Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...

SAN JOSE, Calif. — IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium ...