Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Success will depend on new tools, a better understanding of who’s responsible, and new methodologies for getting designs out the door more quickly. As systems migrate from a single die in a single ...

A team of Engineering students have developed a cheap, lightweight and portable device, Slate Safe, that could combat package theft problems. According to a survey done by Xfinity Home, package theft ...

“Rapid Fire with Medical Packaging Trailblazers” on June 15 during Virtual Engineering Days will cover several pressing issues in medical device packaging. Rod Patch, senior director, package ...