Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Subramanian Iyer, distinguished chancellor’s professor in UCLA’s Electrical Engineering Department—and a former fellow and director of the systems scaling technology department at IBM—sat down with ...

A team of Engineering students have developed a cheap, lightweight and portable device, Slate Safe, that could combat package theft problems. According to a survey done by Xfinity Home, package theft ...

“Rapid Fire with Medical Packaging Trailblazers” on June 15 during Virtual Engineering Days will cover several pressing issues in medical device packaging. Rod Patch, senior director, package ...

ANAMA Package and Container Testing is located in a small warehouse just outside New York City that is full of strange metal machines that evaluate retail shipping design. The first stop for packages ...