Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Success will depend on new tools, a better understanding of who’s responsible, and new methodologies for getting designs out the door more quickly. As systems migrate from a single die in a single ...

“Rapid Fire with Medical Packaging Trailblazers” on June 15 during Virtual Engineering Days will cover several pressing issues in medical device packaging. Rod Patch, senior director, package ...