Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

A Parliamentary panel has suggested having a benchmark for the "quantum of haircut" in an insolvency process amid instances of financial creditors taking steep haircuts on their exposure to stressed ...

Unlike the conventional recycling method, which makes the materials mix together, hard to separate, and become incomplete, JinkoSolar separates the glass and the silicon wafer through thermal, and ...

When composite freight trailer manufacturer Composittrailer (Lokeren, Belgium) tried to locate a supplier of strong, impact-resistant structural sidewall and floor panels for its heavy-duty, ...

SAN JOSE, Calif. — Chip companies must consider platforms, performance, area, power, mask costs and time-to-market risks when implementing their designs in a given process technology, according to ...

Andrew M. Morris MD SM, Stacey Brener BSc, Linda Dresser PharmD, Nick Daneman MD MSc, Timothy H. Dellit MD, Edina Avdic PharmD MBA and Chaim M. Bell MD PhD Introduction. Antimicrobial stewardship ...

What is the American Trends Panel (ATP)? The American Trends Panel is Pew Research Center’s primary source of survey data for U.S. public opinion research. It is a multimode, probability-based survey ...