CAMBRIDGE, UK — Following up on the availability of Intel's Core-i7 Mobile quad-core processors, Suyin has launched a reversed pin grid array socket (rPGA-989) suitable for automatic assembly. The ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

The first image of AMD's upcoming Socket AM4, the new single platform for its Bristol Ridge and Zen CPU and APU products, has been leaked, revealing a pin-grid array (PGA) design with 1,331 pin ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...