Plasma etching and atomic layer etching (ALE) constitute essential techniques in the fabrication of next‐generation nanoscale devices. Plasma etching utilises ionised gases to selectively remove ...

Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...

Mass spectrometry, by contrast, is a powerful technique for the analysis of any process gas. Careful consideration of differences in pressure, reaction time scales and process flow is essential for ...

The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in. 2 of ...

FREMONT, Calif., Feb. 19, 2025 /PRNewswire/ -- Lam Research Corp. (LRCX) (Nasdaq: LRCX) today introduced Akara ®, a breakthrough innovation in plasma etch and the most advanced conductor etch tool ...

In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...

On Wednesday, U.S. chip equipment maker Lam Research Corp (NASDAQ:LRCX) launched two new tools for building advanced artificial intelligence chips. The company introduced Akara, an innovative plasma ...

Freezing edge technology: A new plasma-based etching process could lead to denser data storage in phones, cameras, and computers. Researchers have developed a hydrogen fluoride plasma technique that ...

Deposition of many important materials such as semi-conductors is performed using energetic jets under low pressure conditions. In addition, materials that have been deposited, such as silicon, are ...

Medical device manufacturers using plasma etchers and plasma surface-preparation systems in Asia should be aware of counterfeit machines being sold in the region. The machines bear the name Plasma ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...