Add Yahoo as a preferred source to see more of our stories on Google. Imagine trying to carve a tiny, complex sculpture into a block the size of your fingernail again ...
A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...
Plasma etching and atomic layer etching (ALE) constitute essential techniques in the fabrication of next‐generation nanoscale devices. Plasma etching utilises ionised gases to selectively remove ...
In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...
Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...
DRESDEN, Germany--(BUSINESS WIRE)--Rain, darkness, the dazzling lights of an oncoming car - strong light reflection in such situations can be irritating or even become dangerous. Effective ...
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...
Development of next-generation power devices is needed for energy saving in a low carbon society. Diamond is a potentially important power device material due to its excellent physical and electronic ...
The fundamentals of a good Bosch etching system are described below; There are a number of significant features of the equipment used for Bosch processing which differ from normal ICP systems: In ...
(Nanowerk News) Physicist Igor Kaganovich at the Department of Energy's (DOE) Princeton Plasma Physics Laboratory (PPPL) and collaborators have uncovered some of the physics that make possible the ...
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...
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