The aerospace industry has been experiencing a period of strong growth. The latest generation of efficient aircraft have helped reduce fares, allowed more non-stops and new city pairs, and enabled the ...

Master Bond Inc offers the widest selection of compounds and the technical expertise to help you meet your potting and encapsulation needs. From relays, connectors and power supplies to surge ...

The global potting compound market was valued at $3.1 billion in 2019, and is projected to reach $4.1 billion by 2027, growing at a CAGR of 3.9% from 2020 to 2027. Potting compounds are used as ...

Master Bond EP30M4 is a two part, room temperature curing potting/encapsulation compound with a 100 to 60 mix ratio by weight. Cures can be accelerated by the use of heat. This will optimize the ...

MasterSil 151 is a two-component, low-viscosity silicone compound for high-performance casting, potting, and encapsulation applications. This material features an operating temperature range of –65° ...

The electronic-grade UV Cure 60-7108 is a low-viscosity curable adhesive and potting compound that maintains its clarity over time. The compound self-levels in and around electronic components, ...

The R-2175 silicone potting compound is used mostly in electronic packages such as power supplies, sensors, and ac/dc and dc/dc high efficiency convertors. Its rheology yields a conformal material ...

AKRON (June 2, 2008) — Master Bond Inc. now has a flexible, low-viscosity potting compound called EP30FL. The compound is 100-percent reactive and does not contain any volatiles. Because of its ...

It mixes in a 1:1 ratio and comes in contrasting-black and white colors to help ease visual QC mixing inspection. The general-purpose, lowviscosity (6,700 cps) compound has a 45-min pot life at 25°C ...