The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...

A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...

Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...

TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including ...

This course introduces the basic concepts of switched-mode converter circuits for controlling and converting electrical power with high efficiency. Principles of converter circuit analysis are ...

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified transportation—researchers at the National Renewable Energy Laboratory have unveiled a ...

Note: This course requires purchase of a parts kit in order to complete assignments. The kit will be used from the first experiment in the 2nd week of class and throughout the course and the following ...

The module is packaged in an innovative vertical construction that maximises board space efficiency and can provide up to a 40% board area reduction when compared to other solutions. The compact power ...