Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Global electricity demand is rising faster than new large power plants can be built, and the cost of that imbalance is ...

This to augment efficiency and lifetime for AI data center, grid, and energy infrastructure and industrial electrification ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

Joe Dobson, Senior Project Delivery Lead at the Advanced Propulsion Centre UK (APC) reports on the ESCAPE project, a collaborative effort to build an end-to-end UK supply chain for silicon carbide ...

Automotive designers face challenges in the move to zero-emissions vehicles like hybrid and electric vehicles, including optimizing energy efficiency, increasing vehicle range, and reducing battery ...