HILLSBORO, OR – APRIL 24, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of its low cost, low power MachXO2™ family of programmable logic ...

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...

Housed in QFN packages, the 24-bit MSC1201 and MSC1202 precision data acquisition chips integrate a low-noise delta-sigma A/D converter, an enhanced 8051 processor core, 4 or 8 Kbytes of flash memory, ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

The package an IC uses has a very significant effect on layout flexibility and layout can make the difference between a great product, a product with questionable reliability and something that just ...

SCOTTSDALE, USA: Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. Put another way, package selection is increasingly important to ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...