Housed in QFN packages, the 24-bit MSC1201 and MSC1202 precision data acquisition chips integrate a low-noise delta-sigma A/D converter, an enhanced 8051 processor core, 4 or 8 Kbytes of flash memory, ...

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...

The package an IC uses has a very significant effect on layout flexibility and layout can make the difference between a great product, a product with questionable reliability and something that just ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...

Housed in a 3 x 3 mm QFN package with ESD protection on all pins, the RF2861 single-band, front-end receiver also integrates a TX LO buffer amplifier. Designed for CDMA, JCDMA and CDMA450 applications ...

HILLSBORO, OR – APRIL 24, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of its low cost, low power MachXO2™ family of programmable logic ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Ironwood Electronics’ SG-MLF-7079 elastomer socket, operating at bandwidths up to 10 GHz with less than 1 dB of insertion loss, is designed for an 8- by 8- by-0.8-mm, 0.5-mm-pitch quad flat no-lead ...