The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...

With almost 10 million SiP shipment, GUC SiP service leads to a fast, low cost, and low risk way to realize products with high embedded memory requirements Hsinchu, Taiwan -- April 14, 2008 –Global ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...