TOKYO — Renesas Technology Corp. has developed a new SRAM memory cell combining SRAM and DRAM technologies. The new cell is about half the size of conventional SRAM cells but retains such advantages ...

Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs.

Tezzaron Semiconductor Inc. last week announced a new type of pseudo-static memory technology intended to provide an alternative to embedded SRAM or DRAM in discrete memory ICs and systems-on-chip.