The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

This edition explores how materials science, nanofabrication, and workforce development intersect to support a resilient U.S.

The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...