SANTA CRUZ, Calif. — By providing detailed, foundry-specific modeling for RF components, United Microelectronics Corp. claims it can reduce electromagnetic simulation time from a matter of hours to ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

This article provides a description of prospective financial simulation methodology and use cases with empirical data for episode-based bundled payments, including implications for contract ...