BEAVERTON, Ore.--(BUSINESS WIRE)--Today the Universal Chiplet Interconnect Express™ (UCIe™) Consortium announced the release of its 2.0 Specification. The UCIe 2.0 Specification adds support for a ...

Plug-and-play chiplets are a popular goal, but does UCIe 2.0 move us any closer to that becoming a reality? The problem is that the current drivers of the standard are not after interoperability in ...

Developers and engineers at the Program Executive Office Intelligence, Electronic Warfare and Sensors (PEO IEW&S) Integration Directorate have been modernizing the US Army’s Integrated Sensor ...

The St. Louis-based architecture, engineering and construction firm is deepening its capabilities in automation and ...