Amidst arrivals of proprietary, internal through-silicon-via (TSV) interconnect solutions by STMicroelectronics and Aptina Imaging (a Micron Technology arm dedicated to imaging and wafer-level cameras ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/b6h7hj/highdensity) has announced the addition of the "High-Density ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced Fan-Out ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...

New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect technology New deposition systems improve the ...

“By incorporating TSV, FOCoS-Bridge enhances compute and energy efficiency, and elevates our advanced packaging portfolio to the next level.” FOCoS-Bridge technology has already demonstrated its ...