EDN

Licensable TSV interconnect technology supports high-yield processes

Amidst arrivals of proprietary, internal through-silicon-via (TSV) interconnect solutions by STMicroelectronics and Aptina Imaging (a Micron Technology arm dedicated to imaging and wafer-level cameras ...
Business Wire

Samsung Electronics Develops Industry's First 12-Layer 3D-TSV Chip Packaging Technology

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...
Seeking Alpha

ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...
Business Wire

OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...
WKRG

Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias

New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect technology New deposition systems improve the ...