Just before fabrication, the design flow of all integrated circuits (ICs) culminates in transistor-based, top-level simulations. Unfortunately, verifying functionality, connectivity, and performance ...

Nothing is worse for a design team than a chip that fails to work in the bringup lab. Electrical problems are historically a major cause of such failures. Power leaks, power-ground DC paths, missing ...

Almost every chip being taped out today is mixed-signal in nature. In addition to increased integration of analog and RF blocks, designers are using complex power-management techniques to minimize ...

WEST LAFAYETTE, Ind. - A simulation of electrical current moving through a futuristic electronic transistor has been modeled atom-by-atom in less than 15 minutes by Purdue University researchers. The ...

Technologies that had become specialist tools are moving back into mainstream usage; shift left is not just about doing things earlier in the flow. A few decades ago, all designers did ...

As the digital semiconductor manufacturing process moves into the FinFET era, more and more front-end-of-line (FEOL) defects are observed due to extremely small feature size and complex manufacturing ...

The different IBIS quality levels. The steps in the IBIS bench measurement procedure. Process for Quality Level 2a and Level 2b validation. The Input/Output Buffer Information Specification (IBIS) is ...