Chicago, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The global wafer dicing services market was valued at US$ 617.5 million in 2025 and is projected to exceed valuation of US$ 932.9 million by 2035 at a CAGR ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

(MENAFN- GlobeNewsWire - Nasdaq) The market currently experiences rapid technological bifurcation where mechanical methods handle standard output while advanced laser solutions address the burgeoning ...

LONDON--(BUSINESS WIRE)--The global wafer dicing saws market size is poised to grow by USD 95.94 million during 2020-2024, progressing at a CAGR of almost 3% throughout the forecast period, according ...

How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

ST. FLORIAN, Austria, June 20, 2017 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today ...

TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...