Date Announced: 11 Apr 2007 J P Sercel Associates announces 100 mm sapphire wafer dicing capability developed with the IX-200 Chromadice™ diode-pumped solid-state (DPSS) UV laser wafer singulation ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...