Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

The first WLCSP device is expected to be technology qualified later this quarter with production release expected in the June 2021 quarter. The new package offers a significantly smaller filter ...

To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

后固化目的：提高材料的交联密度；缓释制造应力。 后固化温度：通常在175度左右（接近Tg温度，分子链相对松弛；催化剂的活性较高。） 后固化时间：4-8H，通常恒温6H（后固化烘箱温度均匀性；后固化烘箱的升温速度。） To plating Sn on the lead which will mount on ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

The new CSP is entering technology qualification in the June quarter with production release expected in the second half of calendar 2021. The first use of this new CSP is for a custom ...

A technical paper titled “Review of virtual wafer process modeling and metrology for advanced technology development” was published by researchers at Coventor Inc., Lam Research. “Semiconductor logic ...

BSI结构需要额外的waferbonding及thinning，背面对准处理（alignmentfor backside process）及背面界面钝化（passivation）等工艺，要求容差非常小，工艺复杂。下表是常用的两种BSI结构工艺，不论采用哪种BSI结构，都需要waferbonding工艺。 以SONY为代表的SOI结构，其成本提高4~5 ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...