Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI ...
Intel is undergoing a major transformation, with its foundry business embodying the "Made in America" mission supported by US President Donald Trump. Naga Chandrasekaran, Intel's EVP and general ...
Lip-Bu Tan, the chief executive of Intel, is considering stopping the promotion of the company's 18A fabrication technology (1.8nm-class) to foundry customers, instead shifting the company's efforts ...
Supports latest interconnect standards, including Universal Chiplet Interconnect Express™ 2.0 and Open Compute Project Bunch of Wires, for improved design flexibility Enhances Keysight’s EDA standards ...
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