In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...

SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero- halogen solder paste is specifically designed for fine-pitch ...

Engineered to withstand 3,000+ thermal cycles at -40 °C/125 °C across different PCB finishes and component types, Durafuse ® HR is ideal for applications requiring an extended mission profile beyond ...