Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.

AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...

Keysight’s Richard Duvall highlights the need for rigorous simulation and validation to overcome challenges such as signal ...

Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...

Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.

A new technical paper titled “Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application” was published by researchers at Seoul National University of Science and ...

A new technical paper titled “Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors” was published by researchers at Rochester Institute of Technology and Corning Research ...

Experts at the Table: Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; ...

Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for ...

Structured Mixed Precision for Efficient Deep Learning Hardware Codesign” was published by Intel. Abstract “In this paper, we ...

Trusting which data to use and what can be deleted still requires human oversight; startups are at a disadvantage.

A new technical paper titled “Sensitivity and contrast of indium nitrate hydrate resist evaluated by low-energy electron beam ...