Multi-die assemblies are the next phase of Moore’s Law, scaling up and out to improve performance and add flexibility into ...
Tightly coordinated data movement and low-latency on-chip storage for real-time environments.
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other ...
A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...
A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...
Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...
Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...
Band Power Side-Channel Detection for Semiconductor Supply Chain Integrity at Scale” was published by researchers at Cornell ...
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