We at SUSS provide the manufacturing solutions behind this, setting new standards with our bonders, coaters, imaging and, ...

In-package liquid cooling will ship to end customers In-package liquid cooling, a novelty for more than a decade, has been ...

ICsense has opened a new Electronic Wafer Sort (EWS) cleanroom as part of its latest strategic investment programme. With the Application-Specific Integrated Circuit (ASIC) ... Semiconductor Packaging ...

A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection ...

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide ...

As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL ...

As data centers race to scale infrastructure for generative AI workloads, power provisioning has become a critical bottleneck, outranking even land value in site selection. ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for a multitude of packaging ...

This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening ...