Having initiated the MOSAICS modular chiplet platform at the Chiplet Summit in 2024, Menta returns in 2026 at a pivotal moment: chiplets are entering a phase where architecture, validation, and system ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Compromising a single weak chiplet or the interconnect can be sufficient to threaten the entire device platform.