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You’re staring at glossy tiles from the late 2000s, dreading the dust and chaos of chipping them off. The question bites: ...

Abstract: As performance gains from 2D scaling and innovation slows, wafer-level hybrid bonding has become a key enabler for 3D scaling and heterogenous integration. Over the last decade, the industry ...

Ring in some festive cheer with our edit of the best-value beauty advent calendars to treat yourself or a loved one this year ...

Abstract: This study proves the applicability of wafer to wafer hybrid bonding to commercialized DRAM products for the first time. A metal interconnection process for bonding Cu pad was carried out on ...

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