Abstract: Recent research has begun adopting Large Language Model (LLM) agents to enhance Virtual Reality (VR) interactions, creating immersive chatbot experiences. However, while current studies ...

Abstract: This study focuses on the fabrication and thermomechanical characterization of Through Silicon Vias (TSV) with diameters spanning 1-4 µm. In terms of TSV fabrication, scallop-free Si etching ...