Abstract: Die attach by low-temperature silver sintering has been widely used in power electronics packaging. Most of the reported work was done on direct-bond-copper (DBC) substrates metallized with ...
The FPGA Addon Custom Device allows users to access an existing FPGA bitfile in VeriStand with little or no modification. The FPGA bitfile does not need to use the standard VeriStand FPGA framework ...
Abstract: The double-sided cooling (DSC) module introduces greater thermomechanical stress compared to single-sided cooling (SSC) modules, posing a significant threat to reliability. The manufacturing ...
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