Through the application of epoxy flux, flip chip packaging solder joints can obtain better mechanical strength and electrical ...

Abstract: With the development of electronic packaging heading toward miniaturization, high-density system-in-package (SiP) assembly processes frequently face challenges with flux cleaning when ...

Abstract: Mass reflow soldering technology using flux have been widely adopted in semiconductor assembly process for decades, particularly in ball grid array (BGA) solder ball attachment process.

Here are six methods for fixing or replacing broken wires, cords, and cables, ranging from beginner to pro. **Featured Products:** - Electrical Tape - Assorted Wire Nuts - Klein Traditional 6-in-1 Wir ...

Detroit — The injury situation and who is and isn't participating in practice is becoming a factor with the regular season beginning next week. The Wings are still waiting on forward James van ...