The EDA Tools market is driven by faster transistor scaling, AI-enabled design flows, and cloud-based verification.

Higher levels of integration and ingenious power-conversion architectures are enabling simpler, denser, more efficient ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Tania Roy studies novel semiconductor materials and devices to advance energy-efficient computing and edge AI.

Taiwan’s chipmaker TSMC said Thursday it will be manufacturing some of the world's most cutting-edge semiconductors in Japan to meet booming artificial intelligence-related demand, in a boost for the ...