Abstract: This letter proposes the use of a chip-on-ceramic heatsink packaging to reduce common-mode (CM) noise at the package level while improving thermal performance for SiC power modules. The ...

Abstract: A high-performance power supply module for chip applications is presented in this paper using 180nm CMOS technology. The module includes a subsection compensation bandgap reference (BGR) and ...

Chinese nuclear scientists have developed a world-class “microscopic scalpel” essential to various forms of chipmaking, potentially unblocking a bottleneck in the country’s efforts to fortify key ...

Huawei Technologies edged out Apple to reclaim the No 1 spot in mainland China’s smartphone market in 2025, a new report showed, as the domestic handset maker overcame crippling US sanctions. For the ...