Abstract: A high-performance power supply module for chip applications is presented in this paper using 180nm CMOS technology. The module includes a subsection compensation bandgap reference (BGR) and ...

Abstract: This letter proposes the use of a chip-on-ceramic heatsink packaging to reduce common-mode (CM) noise at the package level while improving thermal performance for SiC power modules. The ...

Blending economic nationalism with geopolitical leverage, US President Donald Trump’s top trade official delivered a pointed message to Taiwan shortly after Washington announced an ambitious deal on ...

Huawei Technologies edged out Apple to reclaim the No 1 spot in mainland China’s smartphone market in 2025, a new report showed, as the domestic handset maker overcame crippling US sanctions. For the ...