An energy-efficient way to improve the performance of electronics systems would be to integrate microfluidic cooling channels into chips, to prevent overheating. However, state-of-the-art ...

Matioli’s team had managed to engineer a 3D network of microfluidic cooling channels within the chip itself, right under the active part of each transistor device, just a few micrometers away from ...

A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and ...

Liquid cooling moves onto the chip for denser electronics Date: October 5, 2015 Source: Georgia Institute of Technology Summary: Using microfluidic passages cut directly into the backsides of ...

A new technical paper titled “Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization” was published by researchers at Corintis. Abstract: “The continuous ...

In-package (PCB-level) microfluidic cooling; Double-sided microfluidic device cooling within packages; Hotspot prevention of devices at high temperatures. Cooling application in 5G/6G antenna base ...

Transistor-integrated cooling for a more powerful chip. ScienceDaily . Retrieved June 2, 2025 from www.sciencedaily.com / releases / 2020 / 09 / 200909114904.htm ...

The company also noted it is working on microfluidic cooling technologies. Still a nascent technology, microfluidics brings cooling inside the silicon by integrating tiny fluid channels into chip ...

The researchers designed 3D microfluidic structures combining capillary channels and a distribution layer. This architecture enables precise control of the cooling flow, optimizing thermal efficiency.

Frore Systems, another U.S.-based company, is a pioneer in the MEMS-based chip cooling space. It has been trying to get a similar technology called AirJet Mini into laptops since 2022. However ...