LF Edge, an umbrella organization within the Linux Foundation that has created an open, interoperable framework for edge computing independent of hardware, cloud, or operating system, today announced ...

PALO ALTO, Calif., Feb. 03, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global leader in semiconductor and infrastructure software solutions, today announced the industry’s first Wi-Fi 8 ...

Thales has invested in its industrial and technological footprint in Singapore for over 50 years. From the establishment of Avionics activities in 1973 to the launch of cortAIx, Thales’ AI accelerator ...

THNQ’s exposure to semi fabrication, semi equipment, optical interconnects, edge computing, and cloud providers positions the ...

Unified, wireless-first architecture based on latest wireless standard designed to address rising demand for hybrid work, and deliver performance, efficiency and security for next-gen enterprise ...

Hybrid everywhere, AI guarding security, data treated like a product, automation doing the heavy lifting and compute moving ...

Lenovo announced at ISE 2026 that it is rolling out new AI-driven full-room meeting solutions built on ThinkSmart Core Gen 2 and Huddly’s intelligent audio-video systems, aimed at delivering ...

Discover key agreements and investments from the Singapore Airshow, enhancing the nation's aviation and aerospace sectors. Read more at straitstimes.com. Read more at straitstimes.com.

Eko Atlantic is set to become a major hub for Nigeria’s digital transformation as Airtel Nigeria reaffirms its commitment to strengthening the country’s digital infrastructure through the development ...

Jabra’s new PanaCast 55 VBS, PanaCast SpeakerMic and PanaCast Room Kits are part of a new portfolio of expandable meeting ...

Ripple on Monday secured full Electronic Money Institution approval from Luxembourg’s financial regulator, pushing its global license count past 75, but XRP (CRYPTO: XRP) plunged to $1.64 despite the ...

Company announces breakthrough in memory efficiency and silicon readiness for next-gen AI data centers; 3nm Chip Tape-outBARCELONA, Spain, Feb. 3, 2026 ...