Abstract: With scaling down of CMOS circuit technology, the size of CMOS metal interconnect line is getting thinner. After researching of the line-to-line coupling capacitance and line crosstalk ...
Abstract: The memory architecture of 3D vertical gate (3DVG) NAND Flash using plural island-gate SSL decoding method is discussed in detail. In order to provide a good array efficiency, 3DVG shares ...
PDK for minimal Fab LSI fabricaition at AIST ACPS supporting 1st metal only SOI CMOS process. Made public since Nov.1, 2023. PDK_reference_manual.pdf (in Japanese) is ...
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