Abstract: With the increasing operating frequency and integration density of ball grid array (BGA) packaging in high-performance systems, radiation leakage, and signal interference from solder balls ...

Chipmaker AMD announced a slew of products during the inaugural keynote at CES2026, focusing on all three facets of AI deployment: the cloud, PCs, and the edge. The highlight of the evening was the ...

In many games, at 1440p and 4K, there's not a huge difference between the top AM4 and AM5 CPUs anyhow. However, it's challenging to find these older CPUs, so their prices have been rising accordingly.

Abstract: With the development of the semiconductor industry, more advanced electronic packaging solutions are being developed for improved manufacturing processes. The sparse Ball Grid Array (BGA) ...