芯片微缩一直是半导体行业进步的基本驱动力，并且仍然是创新矩阵的基石。硅片路线图由非增量晶体管和互连架构进步、High NA EUV 光刻以及相关的掩模和建模解决方案实现。每代技术的功能扩展和改进都由设计技术协同优化 (DTCO) ...

Opinion | CLP Holdings' David Simmonds discusses China's green development and opportunities for energy transition ...

BEIJING, March 10 (Xinhua) -- China has recently launched a national innovation center for high-end equipment nondestructive ...