EDN

Xilinx XAPP427 Implementation and Solder Reflow Guidelines for Pb-Free Packages Application Note

Application Note: Packaging Implementation and Solder Reflow R Guidelines for Pb-Free Packages XAPP427 (v2.0) September 16, 2004 Summar y Recent legislative directives and corporate driven initiatives ...
Business Insider

SST Vacuum Reflow Systems Launches Automated Vacuum Pressure Soldering System

CARLSBAD, Calif., May 2, 2019 /PRNewswire-PRWeb/ -- Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST ...
EDN

Lead Free Solder Reflow

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...
Business Wire

EFD Solder Paste Group And Leister Technologies Join In Cooperative Worldwide Marketing Effort For Advanced Tabletop Laser Soldering Reflow System

LINCOLN, R.I.--(BUSINESS WIRE)--Aug. 8, 2006--The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, ...