Application Note: Packaging Implementation and Solder Reflow R Guidelines for Pb-Free Packages XAPP427 (v2.0) September 16, 2004 Summar y Recent legislative directives and corporate driven initiatives ...

This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...

LINCOLN, R.I.--(BUSINESS WIRE)--Aug. 8, 2006--The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, ...