Generic test and repair approaches to embedded memory have hit their limit. Smaller feature sizes, such as 130 nm and 90 nm, have made it possible to embed multiple megabits of memory into a single ...

Three-dimensional (3D) memory integration marks a significant advancement in semiconductor technology, enabling higher device densities and enhanced performance for modern applications. However, the ...

New Release of STAR Memory System Expands Availability of Subsystem Beyond Virage Logic Memories to Third-Party and Internally Developed Memories FREMONT, Calif. -- June 2, 2008 -- Virage Logic ...

When Elon Musk said Tesla cars are computers on wheels, he forgot to mention they run on Linux. They also do a lot of logging. According to Jason Hughes, from 057 Technology, more than they should: ...

Optimized memory test and repair algorithms efficiently address new memory defects, including process variation faults and resistive faults, at 20 nanometers (nm) and below New hierarchical ...

San Jose, Calif. - May 6, 2003 - LogicVision, Inc., (NASDAQ:LGVN), a leading provider of embedded test for integrated circuits announces the availability of a silicon proven solution that provides ...

Data loss is a common occurrence. According to a study of Backblaze customers, nearly one in two (46%) users experience data loss each year. More specifically, memory card data loss is a common ...

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