Abstract: Surface mount technology (SMT) is a process for producing printed-circuit boards. The solder paste printer (SPP), package mounter, and solder reflow oven are used for SMT. The board on which ...

Abstract: Solder paste is the main interconnect material to use between FBGA type packages and main boards. It is consisted of different types of solder powers (in case of type 3 size is 25~45um) and ...

The smugglers melt pure gold at high temperatures and add impurities to it. With the prices of gold skyrocketing, India is witnessing a significant increase in the number of smuggling cases. While the ...