Abstract: Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this ...

Grafana Alloy experiences a systematic memory leak when processing CloudWatch logs via AWS Firehose, with encoding/json.(*decodeState).literalStore consuming 97%+ of heap memory. (pprof) top10 Showing ...

Officially, Qualcomm has launched its new flagship mobile processor, the Snapdragon 8 Elite Gen 5, which has a significant performance and efficiency increase versus its predecessor. At the Snapdragon ...

At the Snapdragon Summit 2025, Qualcomm announced the Snapdragon 8 Elite Gen 5, its newest and most powerful flagship mobile chipset to date. Touted as the “world’s fastest mobile system-on-a-chip”, ...

As promised, Qualcomm announced the Snapdragon 8 Elite Gen 5 SoC as its flagship chip at the Snapdragon Summit in Maui, Hawaii. It’s a successor to last year’s Snapdragon 8 Elite and is touted as the ...

Qualcomm on Wednesday announced the Snapdragon 8 Elite Gen 5 chipset for mobile devices at the Snapdragon Summit in Hawaii. According to the company, the newest mobile processor f ...

Don't miss out on our latest stories. Add PCMag as a preferred source on Google. It’s that time of year again when the smartphone arms race heats up. Apple, Google, and MediaTek have all introduced ...

As promised, Qualcomm announced the Snapdragon 8 Elite Gen 5 SoC as its flagship chip at the Snapdragon Summit in Maui, Hawaii. It's a successor to last year's Snapdragon 8 Elite and is touted as the ...

Qualcomm has introduced the Snapdragon 8 Elite Gen 5, its next-gen flagship SoC, at its annual Snapdragon Summit in Hawaii. The Snapdragon 8 Elite Gen 5 follows the Snapdragon 8 Elite, which powered ...