"I love autumn. The leaves are changing colors, falling. Absolutely beautiful. The bountiful crops are being harvested, ...

Abstract: This paper attempts to solve the problem of defect classification for the purpose of automation of the processing of flaw detection results. Article proposes an algorithm based on deep ...

Abstract: In this paper, warpage of fan-out wafer-level packaging (FOWLP) throughout the manufacturing process is investigated to minimize the warpage. FOWLP technology has the advantages of low cost, ...