ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new ...

A new technical paper titled “Insights Into Design Optimization of Negative Capacitance Complementary-FET (CFET)” was ...

Delivering and managing power are becoming key challenges in the rollout of chiplets, adding significantly to design ...

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

In the below example, you can notice that a higher drive strength cell (BUFX20) has less transition time (0.0349ns), results ...

Cadence's Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond.

A new technical paper titled “A Survey on Advancements in THz Technology for 6G: Systems, Circuits, Antennas, and Experiments ...

Advantest offers a full lineup of test solutions for AI-capable chips that perform high-quality, cost-effective tests at high ...

It may not be obvious, but big shifts are underway across the industry that will make it more competitive, strategic, and ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

AI can help with workload distributions when considering on-device versus cloud processing. The latter has a very large ...

Knowing where circuits came from, and the conditions in which they operate, can help designers optimize devices already in ...