Infineon showcases its E-version XDP hybrid flyback controllers for ultra-high power density designs at APEC 2025.

Renesas launches a Li-ion battery management platform, including fuel gauge ICs, MCU and pre-validated firmware at APEC 2025.

TI unveils the first 48-V integrated hot-swap eFuse and a new family of integrated GaN power stages in TOLL packaging.

Embedded medical system designers need to consider several factors in GUI development to ensure efficiency, usability, and ...

Silicon Labs unveils the ultra-low-power BG29 Bluetooth wireless SoCs with expanded memory at Embedded World 2025.

Altera highlights its latest FPGA innovations at Embedded World 2025, including the Agilex 3 and Agilex 5 E-Series FPGAs.

Qualcomm unveils its X85 5G modem-RF, Dragonwing cellular infrastructure platform for 5G O-RAN, and Dragonwing 5G Advanced ...

Medical sensors improve the accuracy of disease detection and treatment planning by enabling accurate diagnostics and ...

Microchip Technology showcases its PIC32A 32-bit MCUs with high-speed analog peripherals at Embedded World 2025.

Precision timing will play a vital role in technology evolution as the heartbeat of intelligent, connected electronics.

Renesas debuts a power-efficient vision AI MPU with an integrated DRP-AI accelerator that eliminates the need for cooling ...

Semtech expands its family of 5G broadband modules to address different performance and cost optimization needs.